Chithandizo cha Matte Side Chochepa Kwambiri Mbiri Mkuwa mu Black/red (VLP-SB/R)

Makulidwe: 10um 12um 18um 25um 35um

Standard M'lifupi: 520mm1040mm 1100mm, Max.1300mm;akhoza kudula malinga ndi kukula kwake

Phukusi la bokosi lamatabwa


Tsatanetsatane wa Zamalonda

Zolemba Zamalonda

Chojambulacho, chomwe chimakhala chonyezimira komanso chotsika kwambiri mbali zonse ziwiri, chimagwiritsidwa ntchito ndi JIMA's micro-roughening process kuti chigwire bwino ntchito komanso kutsika kwamphamvu kwambiri.Amapereka magwiridwe antchito apamwamba m'magawo osiyanasiyana, kuchokera pama board ozungulira okhazikika omwe amaika patsogolo katundu wotumizira ndi kupanga mapangidwe abwino kupita ku mabwalo osinthika osindikizidwa omwe amayika patsogolo kuwonekera.

Tsatanetsatane

● ID: 76 mm, 152 mm
● Utali Wopunthira / M'mimba mwake / M'mimba mwake wamkati: monga pempho
● Utali wapakati: monga pempho
● Zinthu zapakati: Mapepala ndi ABS pulasitiki & Sinthani Mwamakonda Anu
● Zitsanzo zitha kupezeka
● Phukusi Lamkati: limatha kupereka zopangira Vacuum ngati pakufunika

Mawonekedwe

Mbiri yotsika ya FCCL
Mbewu kapangidwe ka mkuwa zojambulazo kumabweretsa kusinthasintha mkulu
Kuchita bwino kwambiri etching
Chojambula chopangidwa ndi chofiira kapena chakuda
Low profile imathandizira kupanga mawonekedwe ozungulira

Ntchito yeniyeni

Kuponya ndi lamination mtundu FCCL
Fine pattern FPC&PWB
Chip pa flex kwa LED
Kwa FPC kapena Inner layer
Kwa mitundu yosiyanasiyana ya ntchito, kuchokera pama board ozungulira kupita ku optics.

Zodziwika bwino za Matte Side Treatment Low Profile Copper Foil
Gulu

Chigawo

Chofunikira

Njira Yoyesera

Kunenepa mwadzina

Um

10

12

16

25

35

Zithunzi za IPC-4562A

Kulemera kwa Malo

g/m²

98 ±4

107±4

153 ± 5

228 ± 8

285 ± 10

IPC-TM-650 2.2.12.2

Chiyero

%

≥99.8

IPC-TM-650 2.3.15

roughness

Mbali yonyezimira (Ra)

սm

≤2.5

≤2.5

≤2.5

≤2.5

≤2.5

IPC-TM-650 2.3.17

Matte mbali (Rz)

um

≤4.0

≤4.5

≤5.5

≤6.0

≤8.0

Kulimba kwamakokedwe

RT(23°C)

Mpa

≥260

≥260

≥280

≥280

≥280

IPC-TM-650 2.4.18

HT(180°C)

≥180

≥180

≥180

≥180

≥180

Elongation

RT(23°C)

%

≥5

≥6

≥8

≥10

≥12

IPC-TM-650 2.4.18

 

HT(180°C)

≥5

≥6

≥7

≥8

≥8

Mphamvu ya Peel(FR-4)

N/mm

≥0.7

0.8

1.0

1.1

1.2

IPC-TM-650 2.4.8

 

lbs/in

≥4

≥4.6

≥5.7

≥6.3

≥6.9

Pinholes & porosity

Nambala

No

IPC-TM-650 2.1.2

Anti-oxidization

RT(23°C)

 

180

 

RT(200°C)

 

60

 

Standard M'lifupi: 520mm 1040mm 1100mm, Max.1300mm May malinga ndi kasitomala pempho telala.

5G High frequency Board Ultra Low Mbiri Copper Foil1

  • Zam'mbuyo:
  • Ena:

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