HTE High Temperature Elongation Copper Foil

makulidwe: 12um 15um 18um 35um 70um 105um

Standard m'lifupi: 1290mm, akhoza kudula monga pempho kukula

Phukusi la bokosi lamatabwa


Tsatanetsatane wa Zamalonda

Zolemba Zamalonda

Tsatanetsatane

makulidwe: 12um 15um 18um 35um 70um 105um
Standard m'lifupi: 1290mm, akhoza kudula monga pempho kukula
Phukusi la bokosi lamatabwa
Ubwino wachokera pa GB/T5230-1995 ndi IPC-4562standard
ID: 76 mm, 152 mm
Utali: Zosinthidwa mwamakonda
Zitsanzo zitha kuperekedwa

Mawonekedwe

Kampaniyo yapanga zojambula zowoneka bwino komanso zamphamvu zamkuwa zotsika kwambiri komanso zotentha kwambiri.Chojambulachi chimakhala ndi njere zabwino zofananira komanso kukulitsa kwambiri ndipo zimatha kuteteza ming'alu yomwe imabwera chifukwa cha kupsinjika kwamafuta, motero ndi yoyenera zigawo zamkati ndi zakunja za bolodi lamitundu yambiri.Ndi mlingo wochepa wa roughness pamwamba ndi etchability kwambiri, izo ntchito kwa mkulu kachulukidwe ndi woonda.Ndi mphamvu yolimba kwambiri, imathandizira kusinthasintha ndipo imagwiritsidwa ntchito makamaka mu multilayer PCB komanso flex plate.Ndi kulimba mtima komanso kulimba mtima, sikung'ambika m'mphepete kapena kupindika, kumathandizira kwambiri kuchuluka kwa zinthu.

The ankachitira zojambulazo mu imvi kapena wofiira
High peel mphamvu
Zabwino etchability
Kukana kwabwino kwa dzimbiri
Anti zojambulazo kusweka ndi elongation mkulu pa kutentha okwera
High elongation pambuyo mankhwala ndi kutentha kwambiri kapena annealing.
Pamwamba THE katundu.
Zothandiza kupewa kusweka mbale.

Kugwiritsa ntchito

Polyimide board
Epoxy board
CEM-3, FR-4, FR-5, Hydrocarbon gawo lapansi
Multilayer board
High Tg, yopanda lead ndi halogen, Middle Tg
Kukana kwabwino kwa kutentha kwa coefficient

Zodziwika bwino za High Temperature Elongation Copper Foil

Gulu

Chigawo

Chofunikira

Njira Yoyesera

Kunenepa mwadzina

Um

12

18

35

70

105

Zithunzi za IPC-4562A

Kulemera kwa Malo

g/m²

107 ± 5

153 ± 7

285 ± 10

585 ± 20

870 ± 30

IPC-TM-650 2.2.12.2

Chiyero

%

≥99.8

IPC-TM-650 2.3.15

roughness

Mbali yonyezimira (Ra)

սm

≤0.43

≤0.43

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Matte mbali (Rz)

um

≤6

≤8

≤10

≤15

≤20

Kulimba kwamakokedwe

RT(23°C)

Mpa

≥207

≥207

≥276

≥276

≥276

IPC-TM-650 2.4.18

HT(180°C)

≥103

≥103

≥138

≥138

≥138

Elongation

RT(23°C)

%

≥2

≥2

≥3

≥3

≥4

IPC-TM-650 2.4.18

 

HT(180°C)

≥2

≥2

≥2

≥3

≥3

Rkusistivity

Ω.g/m²

≤0.17

≤0.166

≤0.16

≤0.162

≤0.162

IPC-TM-650 2.5.14

Mphamvu ya Peel(FR-4)

N/mm

≥0.9

≥1.1

≥1.4

≥2.0

≥2.0

IPC-TM-650 2.4.8

 

lbs/in

≥5.1

≥6.3

≥8.0

≥11.4

≥11.4

Pinholes & porosity

Nambala

No

IPC-TM-650 2.1.2

Anti-oxidization

RT(23°C)

 

180

 

RT(200°C)

 

40

 

Standard Width, 1295 (± 1) mm, M'lifupi osiyanasiyana: 200-1340mm.May malinga ndi kasitomala pempho telala.
Timayesa mphamvu ya peel ndi prepreg ya FR-4(Tg140), chonde tsimikiziraninso ndi tsamba lanu.

5G High frequency Board Ultra Low Mbiri Copper Foil1

  • Zam'mbuyo:
  • Ena:

  • Lembani uthenga wanu apa ndikutumiza kwa ife