Chithandizo cha Matte Side Chotsika Mbiri Mkuwa wakuda/wofiira (LP-SB/R)

Makulidwe: 10um 12um 18um 25um 35um

Standard M'lifupi: 520mm1040mm 1100mm, Max.1300mm;akhoza kudula malinga ndi kukula kwake

Phukusi la bokosi lamatabwa


Tsatanetsatane wa Zamalonda

Zolemba Zamalonda

Tsatanetsatane

Makulidwe: 10um 12um 18um 25um 35um
Standard M'lifupi: 520mm1040mm 1100mm, Max.1300mm;akhoza kudula malinga ndi kukula kwake.
Phukusi la bokosi lamatabwa
ID: 76 mm, 152 mm
Utali: Zosinthidwa mwamakonda
Zitsanzo zitha kuperekedwa

Mawonekedwe

Mwa kuonjezera kachulukidwe a roughening mankhwala particles poyerekeza ndi m'mbuyomu mankhwala, kopitilira muyeso otsika roughness mkuwa zojambulazo amadzitamandira mwamphamvu magawo osiyanasiyana popanda kuwonjezeka roughness.Kuphatikiza pa mphamvu yomatira, imaperekanso zinthu zina zosiyanasiyana zomwe zimathandizira magwiridwe antchito ndikuwongolera mwachindunji kudalirika kwa board, monga kukana kutentha kwanthawi yayitali komanso kukana mankhwala.

Mbiri yotsika ya FCCL
Mbewu kapangidwe ka mkuwa zojambulazo kumabweretsa kusinthasintha mkulu
Kuchita bwino kwambiri etching
Chojambula chopangidwa ndi chofiira kapena chakuda
Low profile imathandizira kupanga mawonekedwe ozungulira

Ntchito yeniyeni

Kuponya ndi lamination mtundu FCCL
Fine pattern FPC&PWB
Chip pa flex kwa LED
Kwa FPC kapena Inner layer
Ngakhale ndizovuta kwambiri, zojambulazo zimapereka mphamvu zomatira kwambiri, kukana kutentha, komanso kukana kwa mankhwala kuti zigwiritsidwe ntchito zosiyanasiyana.

Zodziwika bwino za Matte Side Treatment Low Profile Copper Foil
Gulu

Chigawo

Chofunikira

Njira Yoyesera

Kunenepa mwadzina

Um

10

12

16

25

35

Zithunzi za IPC-4562A

Kulemera kwa Malo

g/m²

98 ±4

107±4

153 ± 5

228 ± 8

285 ± 10

IPC-TM-650 2.2.12.2

Chiyero

%

≥99.8

IPC-TM-650 2.3.15

roughness

Mbali yonyezimira (Ra)

սm

≤2.5

≤2.5

≤2.5

≤2.5

≤2.5

IPC-TM-650 2.3.17

Matte mbali (Rz)

um

≤4.0

≤4.5

≤5.5

≤6.0

≤8.0

Kulimba kwamakokedwe

RT(23°C)

Mpa

≥260

≥260

≥280

≥280

≥280

IPC-TM-650 2.4.18

HT(180°C)

≥180

≥180

≥180

≥180

≥180

Elongation

RT(23°C)

%

≥5

≥6

≥8

≥10

≥12

IPC-TM-650 2.4.18

 

HT(180°C)

≥5

≥6

≥7

≥8

≥8

Mphamvu ya Peel(FR-4)

N/mm

≥0.7

0.8

1.0

1.1

1.2

IPC-TM-650 2.4.8

 

lbs/in

≥4

≥4.6

≥5.7

≥6.3

≥6.9

Pinholes & porosity

Nambala

No

IPC-TM-650 2.1.2

Anti-oxidization

RT(23°C)

 

180

 

RT(200°C)

 

60

 

Standard M'lifupi: 520mm1040mm 1100mm, Max.1300mm May malinga ndi kasitomala pempho telala.

5G High frequency Board Ultra Low Mbiri Copper Foil1

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