Zolemba Zamkuwa Zochepa Kwambiri (VLP-SP/B)

Chithandizo cha submicron micro-roughening chimawonjezera kwambiri malo osakhudza kuuma, komwe kumathandiza kwambiri pakuwonjezera mphamvu zamamatira.


Tsatanetsatane wa Zamalonda

Zolemba Zamalonda

Chithandizo cha submicron micro-roughening chimawonjezera kwambiri malo osakhudza kuuma, komwe kumathandiza kwambiri pakuwonjezera mphamvu zamamatira.Ndi kumatira kwakukulu kwa tinthu, palibe nkhawa kuti tinthu tating'onoting'ono titha kugwa ndikuyipitsa mizere.Mtengo wa Rzjis pambuyo pa roughening umasungidwa pa 1.0 µm ndipo kuwonekera kwa filimuyo pambuyo pokhazikika ndikwabwino.

Tsatanetsatane

makulidwe: 12um 18um 35um 50um 70um
Standard Width: 1290mm, M'lifupi osiyanasiyana: 200-1340mm, akhoza kudula monga pa pempho kukula.
Phukusi la bokosi lamatabwa
ID: 76 mm, 152 mm
Utali: Zosinthidwa mwamakonda
Zitsanzo zitha kuperekedwa

Mawonekedwe

Chojambulacho chopangidwa ndi pinki kapena chakuda cha electrolytic copper chotsika kwambiri.Poyerekeza ndi zojambula zamkuwa za electrolytic nthawi zonse, zojambulazo za VLP zimakhala ndi makhiristo abwino kwambiri, omwe ali ofanana ndi zitunda zathyathyathya, zokhala ndi 0.55μm pamwamba, ndipo zimakhala ndi zoyenerera monga kukhazikika kwa kukula kwake komanso kuuma kwakukulu.Izi zimagwiritsidwa ntchito pazida zothamanga kwambiri komanso zothamanga kwambiri, makamaka ma board osinthika osinthika, ma board othamanga kwambiri, ndi ma board oyendetsa bwino kwambiri.
Mbiri Yotsika Kwambiri
Mtengo waukulu wa MIT
Wabwino etchability

Kugwiritsa ntchito

2layer 3layer FPC
EMI
Njira yabwino yozungulira
Foni yam'manja Wireless charger
High frequency board

Zodziwika bwino za Chojambula Chotsika Kwambiri cha Copper

Gulu

Chigawo

Chofunikira

Njira Yoyesera

Kunenepa mwadzina

Um

12

18

35

50

70

Zithunzi za IPC-4562A

Kulemera kwa Malo

g/m²

107 ± 5

153 ± 7

285 ± 10

435 ± 15

585 ± 20

IPC-TM-650 2.2.12.2

Chiyero

%

≥99.8

IPC-TM-650 2.3.15

roughness

Mbali yonyezimira (Ra)

սm

≤0.43

IPC-TM-650 2.3.17

Matte mbali (Rz)

um

≤3.0

≤3.0

≤3.0

≤3.0

≤3.0

Kulimba kwamakokedwe

RT(23°C)

Mpa

≥300

IPC-TM-650 2.4.18

HT(180°C)

≥180

Elongation

RT(23°C)

%

≥5

≥6

≥8

≥10

≥10

IPC-TM-650 2.4.18

HT(180°C

≥6

≥6

≥6

≥6

≥6

Mphamvu ya Peel(FR-4)

N/mm

≥0.8

≥0.8

≥1.0

≥1.2

≥1.4

IPC-TM-650 2.4.8

lbs/mu

≥4.6

≥4.6

≥5.7

≥6.8

≥8.0

Pinholes & Porosity Nambala

No

IPC-TM-650 2.1.2

Anti-oxidization RT(23°C) Dayi

180

 
HT(200°C)

Mphindi

30

/

5G High frequency Board Ultra Low Mbiri Copper Foil1

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