Chojambula Chotsika Chotsitsimutsa Chojambula Chamkuwa Cholipiritsa Opanda Ziwaya

makulidwe: 12um 18um 35um 50um 70um

Standard m'lifupi: 1290mm, akhoza kudula monga pa pempho kukula.

Phukusi la bokosi lamatabwa


Tsatanetsatane wa Zamalonda

Zolemba Zamalonda

Tsatanetsatane

makulidwe: 12um 18um 35um 50um 70um
Standard m'lifupi: 1290mm, akhoza kudula monga pa pempho kukula
Phukusi la bokosi lamatabwa
ID: 76 mm, 152 mm
Utali: Zosinthidwa mwamakonda

Mawonekedwe

Mbiri yotsika ya FCCL
Mtengo waukulu wa MIT
Wabwino etchability
Chojambula chopangidwa ndi pinki kapena chakuda
Bwezerani zojambulazo za mkuwa
Zopanda arsenic, zobiriwira

Kugwiritsa ntchito

2 FPC
EMI
Foni yam'manja Wireless charger

Zodziwika bwino za Low Profile Reverse Treated Copper Foil

Gulu

Chigawo

Chofunikira

Njira Yoyesera

Kunenepa mwadzina

Um

12

18

35

50

70

Zithunzi za IPC-4562A

Kulemera kwa Malo

g/m²

107 ± 5

153 ± 7

285 ± 10

435 ± 15

585 ± 20

IPC-TM-650 2.2.12.2

Chiyero

%

≥99.8

IPC-TM-650 2.3.15

roughness

Mbali yonyezimira (Ra)

սm

≤3.0

IPC-TM-650 2.3.17

Matte mbali (Rz)

um

≤3.0

≤4.0

≤6.0

≤8.0

≤10

Kulimba kwamakokedwe

RT(23°C)

Mpa

≥207

≥276

IPC-TM-650 2.4.18

HT(180°C)

≥103

≥138

Elongation

RT(23°C)

%

≥4

≥4

≥8

≥10

≥12

IPC-TM-650 2.4.18

HT(180°C

≥4

≥4

≥6

≥8

≥8

Mphamvu ya Peel(FR-4)

N/mm

≥0.7

≥0.8

≥1.0

≥1.2

≥1.3

IPC-TM-650 2.4.8

Lbs/in

≥4.0

≥4.6

≥5.7

≥6.9

≥7.4

 

Pinholes & Porosity Nambala

No

IPC-TM-650 2.1.2

Anti-oxidization RT(23°C) Dayi

180

 
HT(200°C) Mphindi

60

 

Standard Width, 1295 (± 1) mm, M'lifupi osiyanasiyana: 200-1340mm.May malinga ndi kasitomala pempho telala.

5G High frequency Board Ultra Low Mbiri Copper Foil1

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