Zolemba Zamkuwa Zochepa Kwambiri (VLP-SP/B)

Chithandizo cha submicron micro-roughening chimawonjezera kwambiri malo osakhudza kuuma, komwe kumathandiza kwambiri pakuwonjezera mphamvu zamamatira.

Titumizireni imelo

Tsatanetsatane wa Zamalonda

Zolemba Zamalonda

Chithandizo cha submicron micro-roughening chimawonjezera kwambiri malo osakhudza kuuma, komwe kumathandiza kwambiri pakuwonjezera mphamvu zamamatira.Ndi kumatira kwakukulu kwa tinthu, palibe nkhawa kuti tinthu tating'onoting'ono titha kugwa ndikuyipitsa mizere.Mtengo wa Rzjis pambuyo pa roughening umasungidwa pa 1.0 µm ndipo kuwonekera kwa filimuyo pambuyo pokhazikika ndikwabwino.

Tsatanetsatane

●makulidwe: 12um 18um 35um 50um 70um
●Standard Width: 1290mm, M'lifupi osiyanasiyana: 200-1340mm, akhoza kudula monga pa pempho kukula.
●Phukusi la bokosi lamatabwa
●ID: 76 mm, 152 mm
●Utali: Zosinthidwa mwamakonda
●Zitsanzo zitha kuperekedwa

Mawonekedwe

Chojambulacho chopangidwa ndi pinki kapena chakuda cha electrolytic copper chotsika kwambiri.Poyerekeza ndi zojambula zamkuwa za electrolytic nthawi zonse, zojambulazo za VLP zimakhala ndi makhiristo abwino kwambiri, omwe ali ofanana ndi zitunda zathyathyathya, zokhala ndi 0.55μm pamwamba, ndipo zimakhala ndi zoyenerera monga kukhazikika kwa kukula kwake komanso kuuma kwakukulu.Izi zimagwiritsidwa ntchito pazida zothamanga kwambiri komanso zothamanga kwambiri, makamaka ma board osinthika osinthika, ma board othamanga kwambiri, ndi ma board oyendetsa bwino kwambiri.
●Mbiri Yotsika Kwambiri
●Mtengo waukulu wa MIT
●Wabwino etchability

Kugwiritsa ntchito

●2layer 3layer FPC
●EMI
●Njira yabwino yozungulira
●Foni yam'manja Wireless charger
●High frequency board

Zodziwika bwino za Chojambula Chotsika Kwambiri cha Copper

Gulu		Chigawo	Chofunikira					Njira Yoyesera
Kunenepa mwadzina		Um	12	18	35	50	70	Zithunzi za IPC-4562A
Kulemera kwa Malo		g/m²	107 ± 5	153 ± 7	285 ± 10	435 ± 15	585 ± 20	IPC-TM-650 2.2.12.2
Chiyero		%	≥99.8					IPC-TM-650 2.3.15
roughness	Mbali yonyezimira (Ra)	սm	≤0.43					IPC-TM-650 2.3.17
roughness	Matte mbali (Rz)	um	≤3.0	≤3.0	≤3.0	≤3.0	≤3.0	IPC-TM-650 2.3.17
Kulimba kwamakokedwe	RT(23°C)	Mpa	≥300					IPC-TM-650 2.4.18
Kulimba kwamakokedwe	HT(180°C)	Mpa	≥180					IPC-TM-650 2.4.18
Elongation	RT(23°C)	%	≥5	≥6	≥8	≥10	≥10	IPC-TM-650 2.4.18
Elongation	HT(180°C	%	≥6	≥6	≥6	≥6	≥6	IPC-TM-650 2.4.18
Mphamvu ya Peel(FR-4)		N/mm	≥0.8	≥0.8	≥1.0	≥1.2	≥1.4	IPC-TM-650 2.4.8
Mphamvu ya Peel(FR-4)		lbs/mu	≥4.6	≥4.6	≥5.7	≥6.8	≥8.0	IPC-TM-650 2.4.8
Pinholes & Porosity		Nambala	No					IPC-TM-650 2.1.2
Anti-oxidization	RT(23°C)	Dayi	180
Anti-oxidization	HT(200°C)	Mphindi	30					/