Ultra Low Profile Copper Foil Kwa 5G High frequency Board

●makulidwe: 12um 18um 35um

●Standard M'lifupi: 1290mm, Max.kutalika 1340 mm;akhoza kudula malinga ndi kukula kwake

●Phukusi la bokosi lamatabwa

Tsatanetsatane wa Zamalonda

Zolemba Zamalonda

Chojambulacho, chomwe chimakhala chonyezimira komanso chotsika kwambiri mbali zonse ziwiri, chimagwiritsidwa ntchito ndi njira ya JIMA Copper proprietary micro-roughening kuti ikwaniritse ntchito yozikika kwambiri komanso yotsika kwambiri.Amapereka magwiridwe antchito apamwamba m'magawo osiyanasiyana, kuchokera pama board ozungulira okhazikika omwe amaika patsogolo katundu wotumizira ndi kupanga mapangidwe abwino kupita ku mabwalo osinthika osindikizidwa omwe amayika patsogolo kuwonekera.

Mawonekedwe

●Mawonekedwe otsika kwambiri okhala ndi mphamvu ya peel yayikulu komanso luso labwino la etch.
●Hyper Low coarsening teknoloji, microstructure imapangitsa kuti ikhale chinthu chabwino kwambiri chogwiritsira ntchito maulendo apamwamba kwambiri.
●Chojambula chopangidwa ndi pinki.

Ntchito yeniyeni

●Mkulu pafupipafupi kufala dera
●Base station/Seva
●Kuthamanga kwa digito
●PPO/PPE

Makhalidwe Odziwika a Ultra Low Profile Copper Foil

Gulu		Chigawo	Njira Yoyesera			Tndi Njira
Kunenepa mwadzina		Um	12	18	35	Zithunzi za IPC-4562A
Kulemera kwa Malo		g/m²	107 ± 5	153 ± 7	285 ± 10	IPC-TM-650 2.2.12.2
Chiyero		%	≥99.8			IPC-TM-650 2.3.15
Ukali	Mbali yonyezimira (Ra)	սm	≤0.43	≤0.43	≤0.43	IPC-TM-650 2.3.17
Ukali	Matte mbali (Rz)	um	1.5-2.0	1.5-2.0	1.5-2.0
Kulimba kwamakokedwe	RT(23°C)	Mpa	≥300	≥300	≥300	IPC-TM-650 2.4.18
Kulimba kwamakokedwe	HT(180°C)	Mpa	≥180	≥180	≥180
Elongation	RT(23°C)	%	≥5	≥6	≥8	IPC-TM-650 2.4.18
Elongation	HT(180°C)	%	≥6	≥6	≥6
Pinholes & Porosity		Nambala	No			IPC-TM-650 2.1.2
Peel Mphamvu		N/mm	≥0.6	≥0.8	≥1.0	IPC-TM-650 2.4.8
Peel Mphamvu		Lbs/in	≥3.4	≥4.6	≥5.7	IPC-TM-650 2.4.8
Anti-oxidization	RT(23°C)	Masiku	90
Anti-oxidization	RT(200°C)	Mphindi	40