Zolemba Zamkuwa Zochepa (LP -SP/B)

makulidwe: 12um 15um 18um 35um 70um 105um

Standard m'lifupi: 1290mm, akhoza kudula monga pempho kukula

Phukusi la bokosi lamatabwa


Tsatanetsatane wa Zamalonda

Zolemba Zamalonda

Tsatanetsatane

makulidwe: 12um 18um 25um 35um 50um 70um 105um
Standard m'lifupi: 1290mm, akhoza kudula monga pempho kukula
Phukusi la bokosi lamatabwa
ID: 76 mm, 152 mm
Utali: Zosinthidwa mwamakonda
Zitsanzo zitha kuperekedwa

Mawonekedwe

Chojambulacho chimagwiritsidwa ntchito makamaka pa PCBs multilayered ndi matabwa apamwamba kwambiri, zomwe zimafuna kuti kuuma kwapamwamba kwa zojambulazo zikhale zochepa kusiyana ndi zojambulazo zamkuwa zokhazikika kuti machitidwe awo monga kukana peeling akhalebe pamtunda wapamwamba.Ndi gulu lapadera la zojambula zamkuwa za electrolytic zokhala ndi roughness control.Poyerekeza ndi zojambula zamkuwa za electrolytic nthawi zonse, makhiristo a LP copper zojambulazo ndi mbewu zabwino kwambiri zofananira (<2/zm).Amakhala ndi makhiristo a lamellar m'malo mwa columnar, pomwe amakhala ndi zitunda zathyathyathya komanso otsika kwambiri.Iwo ali ndi zoyenerera monga kukhazikika kwa kukula bwino ndi kuuma kwakukulu.

Mbiri yotsika ya FCCL
Mtengo waukulu wa MIT
Wabwino etchability
Chojambula chopangidwa ndi pinki kapena chakuda

Kugwiritsa ntchito

3 wosanjikiza FCCL
EMI

Zomwe zili za Low Profile Copper Foil (LP -SP/B)

Gulu

Chigawo

Chofunikira

Njira Yoyesera

Kunenepa mwadzina

Um

12

18

25

35

50

70

105

Zithunzi za IPC-4562A

Kulemera kwa Malo

g/m²

107 ± 5

153 ± 7

225 ± 8

285 ± 10

435 ± 15

585 ± 20

870 ± 30

IPC-TM-650 2.2.12.2

Chiyero

%

≥99.8

IPC-TM-650 2.3.15

roughness

Mbali yonyezimira (Ra)

սm

≤0.43

IPC-TM-650 2.3.17

Matte mbali (Rz)

um

≤4.5

≤5.0

≤6.0

≤7.0

≤8.0

≤12

≤14

Kulimba kwamakokedwe

RT(23°C)

Mpa

≥207

≥276

IPC-TM-650 2.4.18

HT(180°C)

≥138

Elongation

RT(23°C)

%

≥4

≥4

≥5

≥8

≥10

≥12

≥12

IPC-TM-650 2.4.18

HT(180°C

≥4

≥4

≥5

≥6

≥8

≥8

≥8

Rkusistivity

Ω.g/m²

≤0.17 0

≤0.1 66

 

≤0.16 2

 

≤0.16 2

≤0.16 2

IPC-TM-650 2.5.14

Mphamvu ya Peel(FR-4)

N/mm

≥1.0

≥1.3

 

≥1.6

 

≥1.6

≥2.1

IPC-TM-650 2.4.8

Pinholes & Porosity Nambala

 

 

No

IPC-TM-650 2.1.2

Anti-oxidization RT(23°C) Dayi

 

 

180

 
HT(200°C) Mphindi

 

 

30

 

Standard Width, 1295 (± 1) mm, M'lifupi osiyanasiyana: 200-1340mm.May malinga ndi kasitomala pempho telala.

5G High frequency Board Ultra Low Mbiri Copper Foil1

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